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1 ch high side switch ics 1.5a current limit high side switch i cs BD82000FVJ bd82001fvj general description BD82000FVJ and bd82001fvj are low on -r esistance high - side power switches using n-c hannel mosfet s for universal serial bus (usb) applications. the se ics have built - in over - current pro tection, thermal shutdown, under - voltage lockout and soft - start functions. features ? built -in low o n- resistance ( typ 70 m) n-c hannel mosfet ? current limit t hreshold 1.5a ? control input logic ? active low control logic: BD82000FVJ ? active high control logic : bd82001fvj ? soft - start circuit ? over - current protection ? thermal shutdown ? under - voltage lockout protection ? open - drain f ault flag output ? ttl enable input applications pc, pc p eripheral e quipment, usb h ub in c onsumer a ppliances and so forth key specifications ? i nput v oltage r ange: 2.7v to 5.5v ? on -r esistance: 7 0m (typ ) ? over -c urrent t hreshold : 1.0 a (m in ) , 2.0 a (m ax ) ? number o f c hannels : 1ch ? output rise time: 0.8ms(typ) ? s tandby current: 0.01 a ( typ ) ? operating temperature r ange : - 40 c to +85 c package w (typ) d (typ) h (max) typical application circuit lineup c urrent limit t hreshold control i nput l ogic package orderable part number min typ max 1. 0a 1 .5a 2. 0a low tssop-b8j reel of 2 5 00 BD82000FVJ -e2 1. 0a 1 .5a 2. 0a high tssop-b8j reel of 2 5 00 bd82001fvj -e2 ts sop - b 8 j 3.00mm x 4.90mm x 1.10mm out out out in in /oc gnd 5v(typ.) c l c i n - + en( /en ) 3.3 v 10k ~ 100k v out 10k to 100k 5v(typ) produ ct structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays 1/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201 - 0e3e0h300340 -1-2 datashee t
b d82000fvj bd82001fvj block diagram uvlo in gnd charge pump gate logic ocd tsd in en /en out out out /oc pin configuration s 1 2 3 4 8 7 6 5 out out out /oc gnd in in /en 1 2 3 4 8 7 6 5 out out out /oc gnd in in en pin description pin no. symbol i / o f unction 1 gnd - ground 2, 3 in - switch input and the supply voltage for the ic. at use, connect both pin s together . 4 en , /en i enable input. /en: low level input turns on the switch .(BD82000FVJ) en: high level input turns on the switch .(bd82001fvj) high level input > 2.0v, l ow level input < 0.8v. 5 /oc o over - current detection terminal. low level output during over -curren t or over - temperature condition. open - drain fault flag output. 6, 7, 8 out o power switch output. at use, connect each pin together . BD82000FVJ (top view) bd82001fvj (top view) 2/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj absolute maximum ratings ( ta=25 c) parameter symbol r ating unit supply v oltage v in - 0.3 to + 6.0 v enable input v olta ge v en , v /en - 0.3 to + 6.0 v /oc v oltage v /oc - 0.3 to + 6.0 v /oc sink c urrent i /oc 5 ma out v oltage v out - 0.3 to + 6.0 v storage t emperature tstg - 55 to + 150 c power d issipation pd 0.58 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass - epoxy pcb . derat e by 4.7mw/ c above ta=25 c . caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol r ating unit min typ max operating v oltage v in 2.7 - 5.5 v op erating t emp erature topr -40 - + 85 c electrical characteristics BD82000FVJ (v in = 5.0v, ta = 25 c , unless otherwise specified) parameter symbol limit unit condition s min typ max operating c urrent i dd - 110 160 a v /en = 0v , out=open standby c urrent i stb - 0.01 1 a v /en = 5v , out=open /en input v oltage v /en h 2.0 - - v high i nput v /en l - - 0.8 v low i nput /en input c urrent i /en - 1.0 + 0.01 + 1.0 a v /en = 0v or v /en = 5v /oc output low v oltage v /ocl - - 0.5 v i /oc = 0.5ma /oc output leak c urrent i l/oc - 0.01 1 a v /oc = 5v /oc delay t ime t /oc 10 15 20 ms on -r esistance r on - 70 110 m i out = 500ma switch leak c urrent i lsw - - 1.0 a v /en = 5v, v out = 0v current limit t hreshold i th 1.0 1.5 2.0 a short circuit c urrent i sc 0.7 1.0 1.4 a v out = 0v c l = 47f (rms) output rise t ime t on1 - 0.8 10 ms r l = 10 output turn on t ime t on2 - 1.1 20 ms r l = 10 output fall t ime t off1 - 5 20 s r l = 10 output turn o ff t ime t off2 - 10 40 s r l = 10 uvlo threshol d v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in 3/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj electrical characteristics ? continued bd82001fvj (v in = 5.0v, ta = 25 c , unless otherwise specified) parameter symbol limits unit conditions min. t p. max. operating c urr ent i dd - 110 160 a v en = 5 v , out=open standby c urrent i stb - 0.01 1 a v en = 0 v , out=open en input v oltage v en h 2.0 - - v high i nput v en l - - 0.8 v low i nput en input c urrent i en - 1.0 +0.01 +1.0 a v en = 0v or v /en = 5v /oc output low v oltage v /ocl - - 0.5 v i /oc = 0.5ma /oc output leak c urrent i l/oc - 0.01 1 a v /oc = 5v /oc delay t ime t /oc 10 15 20 ms on -r esistance r on - 70 110 m i out = 500ma switch leak c urrent i lsw - - 1.0 a v en = 0 v, v out = 0v current limit t hreshold i th 1.0 1.5 2.0 a short circuit c urrent i sc 0.7 1.0 1.4 a v out = 0v c l = 47f (rms) output rise t ime t on1 - 0.8 10 ms r l = 10 output turn on t ime t on2 - 1.1 20 ms r l = 10 output fall t ime t off1 - 5 20 s r l = 10 output turn o ff t ime t off2 - 10 40 s r l = 10 uvlo threshold v tuvh 2 .1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in 4/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj measurement circuit gnd in in en(/en) out out out /oc v en (v /en ) 1 f v in a gnd in in en(/en) out out out /oc v en (v /en ) 1 f r l c l v in 10k v in a a. operating c urrent b. en, /en input voltage, output rise / fall t ime gnd in in en(/en) out out out /oc v en (v /en ) 1 f 10k c l v in v in i out a gnd in in en(/en) out out out /oc v en (v /en ) 1 f v in v in i /oc c. on- resistance over -c urrent d etection d. /oc o utput low v oltage fig ure 1. measurement c ircuit timing diagram t on1 v out 10% 90% 90% t off1 t on2 v /en v / enl t off2 v /enh t on1 v out 10% 90% 90% t off1 t on2 v en v enh t off2 v enl fig ure 2. timing diagram ( BD82000FVJ ) fig ure 3. timing diagram ( bd82001fvj ) 5/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical performance curves figure 4. operating c urrent vs supply voltage ( en , / en e nable ) 0 20 40 60 80 100 120 140 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [a] ta=25 c figure 6. standby current vs supply voltage ( en, /en d isable ) figure 5. operating current vs ambient temperature ( en , / en e nable ) 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[] operating current : i dd [a] v in =5.0v 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] ta=25 c figure 7. st andby current vs ambient temperature (en, /en d isable ) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb [a] v in =5.0v 6/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 15 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical performance curve s - continued figure 1 0. o n - r esistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] on resistance : r on [m] ta=25 c figure 11. o n - r esistance vs ambient temperature 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[] on resistance : r on [m] v in =5.0v figure 8. en , / en i nput v oltage vs supply voltage 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en , v /en [v] 0 low to high high to low ta=25 c figure 9. e n , / en in put v oltage vs ambient temperature 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : v en , v /en [v] v in =5.0v high to low low to high 7/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 15 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical performance curves - continued figure 12. current l imit t hreshold vs supply voltage 1.0 1.2 1.4 1.6 1.8 2.0 2 3 4 5 6 supply voltage : v in [v] current limit threshold : i th [a] ta=25 c figur e 14. short c ircuit c urrent vs supply voltage 0.4 0.6 0.8 1.0 1.2 1.4 2 3 4 5 6 supply voltage : v in [v] short-circuit current : i sc [a] ta=25 c figure 13. current l imit t hreshold vs am bient temperature 1.0 1.2 1.4 1.6 1.8 2.0 -50 0 50 100 ambient temperature : ta[ ] current limit threshold : i th [a] v in =5.0v figure 15. sh ort c ircuit c urrent vs ambient temperature 0.4 0.6 0.8 1.0 1.2 1.4 -50 0 50 100 ambient temperature : ta[ ] short-circuit current : i sc [a] v in =5.0v 8/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 15 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical performance curves - continued figure 16. /oc o utput l ow v oltage vs supply voltage 0 20 40 60 80 100 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage : v /oc [mv] ta=25 c fi gure 19. uvlo h ysteresis v oltage vs ambient temperature figure 17. /oc o utput l ow v oltage vs ambient temperature 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[] /oc output low voltage :v /oc [mv] v in =5.0v 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] uvlo hysteresis voltage : v hys [v] figure 18. uvlo threshold voltage vs ambient temperature 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold : v tuvh , v tuvl [v] v tuvh v tuvl 9/ 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 15 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical performance curves - continued figure 2 0. output r ise t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output rise time : t on1 [ms] ta=25 c figure 21. output r ise t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[] output rise time : t on1 [ms] v i n =5.0v figure 22 . output t urn on t ime vs sup ply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output turn on time : t on2 [ms] ta=25 c figure 23. output t urn on t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[] output turn on time : t on2 [ms] v in =5.0v 10/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical performance curves - continued 0 2 4 6 8 10 -50 0 50 100 ambient temperature : ta[ ] output turn off time : t off2 [s] 0 2 4 6 8 10 2 3 4 5 6 supply voltage : v in [v] output turn off time : t off2 [s] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] output fall time : t off1 [s] v in =5.0 v figure 25 . output fall time vs ambient temperature figure 24. output f all t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage: v in [v] output fall time : t off1 [s] ta=25 c ta=25 c figure 26. output t urn off t ime vs supply voltage v in =5.0 v figure 27. output t urn off t ime vs ambient t emperature 11 / 23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical performance curves - continued figure 29. /oc d elay t ime vs ambient temperature figure 28. /oc d elay t ime vs supply voltage 10 12 14 16 18 20 2 3 4 5 6 supply voltage : v in [v] /oc delay time : t /oc [ms] ta=25 c 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[ ] /oc delay time : t /oc [ms] v in =5.0v 12/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical wave f orms (bd82001fvj) time ( 1ms/div.) figure 3 0. output rise characteristic time ( 1ms/ div.) figure 31. output rise characteristic time ( 10ms/div.) figure 33. over - current response ramped load time ( 1ms/div.) figure 32. inrush current response v en (5v/div.) v in =5v r l =10 c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v en ( 5v/div.) v in =5v r l =10 c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v en (5v/div.) v in =5v r l =10 v /oc (5v/div.) i in (0.5a/div.) c l = 47 f c l =100 f c l =147 f v out (5v/div.) v /oc (5v/div.) i out (0.5a/div.) v in =5v c l =100 f 13/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical wave f orms - continued time ( 2ms/div. ) figure 34. over - current response ramped load time ( 5ms/div.) figure 35. over - current response enable to short circuit time ( 5ms/div.) figure 36. over - current response 1 load connected at enable time ( 200ms/div.) figure 37. thermal shutdown 1 lo ad connected at enable v out (5v/div.) v in =5v c l =100 f v /oc (5v/div.) i out (0.5a/div.) v en (5v/div.) v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) v in =5v c l =100 f v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) thermal shutdown i out (1.0a/div.) 14/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical wave f orms - continued time ( 10ms/div.) figure 39. uvlo response decreasing v in time ( 10ms/div.) figure 38. uvlo response increasing v in v in (5v/div.) r l =10 c l =100 f v out (5v/div.) v /oc (5v/div.) i out (0.5a/div.) v in (5v/d iv.) r l =10 c l =100 f v out (5v/div.) v /oc (5v/div.) i out (0.5a/div.) 15/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj typical application circuit in out regulator out out out in in /oc gnd vbus d - d+ gnd usb controller 5v( t yp) 10k to 100k c l c in - + en( /en ) application information when excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and ic . this may cause bad effect s on ic opera tions. in order to avoid this cas e , a bypa ss capacitor (c in ) sh ould be connected across the in terminal and gnd terminal of ic. a 1f capacitor or higher value is recommended. moreover, in order to decrease voltage fluctuations of power source line and ic , connect a low esr capacitor in parallel with c in . a 1 0 f to 100f capacitor or higher value is effective . pull up /oc output by resistance 10k to 100k. set up value s for c l which satisfies the application. this application circuit does no t guarantee its operati on . when using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for e xternal components including ac/dc characteristics as well as dispersion of the ic. functional description 1. switch o peration in terminal and out terminal are connected to the drain and the source of mosfet switch respectively. t he in terminal is also use d as power source input to internal control circuit. when the switch is turned on from en (/en) control input, in terminal and out terminal are connected by a bidirectional 70m (typ) switch . therefore, current flows from out terminal to in terminal since current flows from higher to lower potentials. on the other hand, when the switch is turned off, it is possible to prevent current from flowing reversely from out to in s inc e a parasitic diode between the drain and the source of switch mosfet is not present . 2. thermal s hutdown c ircuit ( tsd) if over - current would continue, the temperature of the ic would increase drastically. if the junction temperature were beyond 170 c (t yp) during the condition of over - current detection, the thermal shutdown circuit operates and turns the power switch off causing the ic to output a fault flag (/oc). then, when the junction temperature decreases lower than 150 c (t yp), the power switch is tur ned on and the fault flag (/oc) is cancelled. t his operation repeats , u nless the cause of the increas e of chip s temperature is removed or the output of power switch is turned off. the thermal shutdown circuit operates when the switch is on (en (/en) signa l is active). 3. over -c urrent d etection (ocd) the over - current detection circuit limits current (i sc ) and outputs fault flag (/oc) when current flowing in each mosfet switch exceeds a specified value.. the over - current detection circuit works when the switch is on (en (/en) signal is active). there are three types of response against over - current : 16/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj (1) when the switch is turned on while the output is in short circuit status, the switch g oe s in to current limit status immediately . (2) when the output short circ uits or high - current load is connected while the switch is on , very large current flows until the over - current limit circuit reacts. when the current detection and limit circuit operates , current limitation is carried out. (3) when the output current increases gradually, current limitation would not operate unless the output current exceeds the over - current detection value. when it exceeds the detection value, current limitation is carried out. 4. under -v oltage l ockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v (typ). if the v in drops below 2.2v (typ) while the switch turns on, then uvlo shuts off the power switch. uvlo has hysteresis of 100mv (typ). under - voltage lockout circuit operates when the switch is on (en (/en) signa l is active). 5. fault fl ag (/oc) o utput fault flag output is n - mos open drain output. during detection of over -current and/or thermal shutdown, the output level will turn low . over - current detection has delay filter. this delay filter prevents current de tection from being sent during instantaneous events such as inrush current at switch on or during hot plug. if fault flag output is unused, /oc pin should be connected to open or ground line. v /en v out i out v /oc output short c ircuit thermal shutdown /oc d elay time fig ure 40. over -c urrent d etection, t hermal s hutdown t iming (BD82000FVJ) v en v out i out v /oc output short c ircuit thermal shutdown /oc d elay time fig ure 41. over -current detection, t hermal s hutdown t iming (bd82001fvj) 17/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj power dissipation (tssop-b8j p ackage ) 0 100 200 300 400 500 600 0 25 50 75 100 125 150 ambient temperature: ta [ ] power dissipation: pd[mw] * 70mm x 70mm x 1.6mm glass epoxy board fig ure 4 2. power d issipat ion c urve (pd- ta curve) i/o equivalen ce circuit symbol pin no. equivalence circuit en(/en) 4 /oc 5 out 6,7,8 ambient temperature: ta [ c] power dissipation: pd [mw] 18/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj operational notes 1. reverse c onnection of p ower s upply co nnecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pins . 2. power s upply l ines de sign the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, conn ect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when th e ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. in r ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especia lly to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 19/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily char ge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regard ing the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers o f other elements, creating a parasitic diode or transistor. for example (refer to figure b elow): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. par asitic diodes inevitably occur in the structure of the ic. the operation of parasitic diod es can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) shoul d be avoided. fig ure 43 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal s hutdown circuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account the p ower dissipation (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c b e transistor (npn) resistor n region close-by parasitic elements 20/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj ordering information b d 8 2 0 0 0 f v j - e 2 part n umber package fvj : tssop -b8j packaging and forming specificati on e2: embossed tape and reel b d 8 2 0 0 1 f v j - e 2 part n umber package fvj : tssop -b8j packaging and forming specification e2: embossed tape and reel marking diagram part number part number marking BD82000FVJ d82000 bd82001fvj d82001 tssop - b8j (top view) part number marking lot number 1pin mark 21/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj physical dimension , tape and reel information package name tssop - b8j 22/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
b d82000fvj bd82001fvj revision history date revision changes 08.mar.2013 001 new release 21.aug.201 4 002 applied the rohm standard style and improved understand ability . 23/23 21.aug.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300340 -1-2
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD82000FVJ package tssop-b8j unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD82000FVJ - web page distribution inventory

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